每一个物理过程
都看得见、算得准
Every physical process —
visible and quantified
云熔智算的引擎从粉末铺设、熔池流动、微观结构、再到残余应力与零件性能，全流程多尺度耦合 — 这是它能在 NIST AM Bench 拿 8 个第一的原因。 Our engine couples powder spreading, melt-pool flow, microstructure, residual stress and bulk properties across scales — which is how it has taken 8 first-place finishes at NIST AM Bench.
从粉末铺设到零件出炉 — 每一个物理过程都在云熔智算里被精确建模。
展开看每个环节我们能做什么。
From powder spreading to part release — every physical step is precisely modeled.
Expand any stage below.
从每一颗粉末
开始建模
Start the model
at every particle
颗粒尺度的离散元仿真覆盖铺粉、飞溅、粘结剂喷射 — 在第一层打印开始之前，就把粉末床的真实物理重现出来。 Particle-scale discrete-element simulation covers spreading, spattering and binder jetting — replicating real powder-bed physics before the first layer prints.
- 01 铺粉机理 Powder spreading 粒径效应、辊式铺粉、聚合物-短纤维复合粉末的高保真建模 Size effects · roller spreading · polymer / short-fiber composites
- 02 飞溅与剥蚀 Spatter & denudation 粉末-金属蒸气-环境气体热-动量耦合的多相流模型 Multi-phase flow: powder · vapor · ambient gas coupling
- 03 粘结剂喷射成型 Binder jetting 粘结剂流动（撞击/铺展/渗透）与粉末运动（碰撞/飞溅/团聚）同步建模 Binder flow (impingement/spread/penetration) ↔ powder motion (collision/spatter/agglomeration)
铺粉 · 飞溅与剥蚀 · 粘结剂喷射Spreading · spatter & denudation · binder jetting
看见熔池里
发生的一切
See everything
inside the melt pool
多物理场耦合求解熔池流动、热源、蒸发、匙孔、多材料熔合 — 连超声、磁场等外场都被纳入模型。哪怕在真空、外太空、水下这些极端环境也能算。 Multi-physics coupled solution of melt-pool flow, heat source, evaporation, keyholing and multi-material fusion — even ultrasound, magnetic fields and extreme environments like vacuum, outer space and underwater.
- 01 物理驱动的热源模型 Physics-informed heat source 电子束量子力学建模·激光多次反射 Ray-tracing·电弧（丝材 WAAM） Quantum-based electron beam · multi-reflection laser ray-tracing · wire arc (WAAM)
- 02 蒸发与匙孔效应 Evaporation & keyholing 从热力学推导、含化学成分依赖的蒸发模型 Thermodynamics-derived evaporation with composition dependence
- 03 多组分 / 多材料 Multi-component 氧化反应、微纳米增强复合材料、原位合金 Oxidation · micro/nano-particle composites · in-situ alloying
- 04 外场作用 External fields 超声细化晶粒、热电磁流体（MHD · 塞贝克效应） Ultrasound grain refinement · thermoelectric MHD (Seebeck)
- 05 极端打印环境 Extreme environments 真空、外太空、水下场景 Vacuum · outer space · underwater
熔池多物理场耦合 · 含热源、蒸发、匙孔、多材料、外场Coupled melt-pool physics · heat / evap / keyhole / multi-mat / fields
晶粒尺度的
设计自由度
Design freedom
at the grain scale
相场建模从形核到粗化逐步演化晶粒结构。识别凝固缺陷、预测枝晶生长，提供合金成分的虚拟筛选 — 在工程师切一刀之前就能定量评估材料选型。 Phase-field modeling evolves grains from nucleation to coarsening. Identifies solidification defects, predicts dendritic growth, and runs virtual screening of alloy compositions — quantitative materials selection before any cut.
- 01 相场晶粒建模 Phase-field grain model 形核 → 生长 → 粗化全流程 Nucleation → growth → coarsening
- 02 纳米颗粒细化晶粒 Nano-particle refinement 异质形核 + 晶界钉扎 Heterogeneous nucleation + boundary pinning
- 03 枝晶生长 / 收缩孔 Dendrite & shrinkage 多网格元胞自动机模型 Multi-grid Cellular Automaton
- 04 枝晶 ↔ 熔池双向耦合 Dendrite ↔ CFD coupling 熔池流动与溶质分布对枝晶生长的影响 Melt flow · solute · dendrite interactions
- 05 抗热裂合金设计 Hot-crack-resistant alloys 成分虚拟筛选 + 定量抗热裂判据 Composition screening + quantitative hot-crack metric
晶粒取向 · 枝晶生长 · 凝固缺陷 · 溶质浓度分布Grain orientation · dendrite growth · solidification defects · solute
从晶粒应力
预测整件翘曲
From grain stress
to part-scale warpage
跨三个尺度耦合：晶粒尺度位错密度 → 介观尺度裂纹萌生 → 宏观尺度整件形变。数据驱动代理模型把仿真嵌入设计闭环，毫秒级评估延展性、疲劳与断裂。 Coupled across three scales: dislocation density at the grain scale → crack initiation at the meso scale → bulk distortion at the part scale. Data-driven surrogates close the design loop with millisecond fatigue, ductility and fracture predictions.
- 01 微观尺度·晶体塑性 Micro · crystal plasticity 晶粒内热应力演化·压-拉循环诱发高密度位错 Intra-grain thermal stress · compression-tension cycles → dislocations
- 02 介观尺度 Meso scale 含粗糙表面与内部孔洞的热应力集中·裂纹萌生 Thermal stress concentration at rough surfaces & voids → crack initiation
- 03 宏观尺度 Macro scale 分布式固有应变驱动的整件翘曲与应变预测 Inherent-strain-driven distortion & strain prediction
- 04 数据驱动代理 Data-driven surrogate 温度场神经网络替代高保真求解 NN temperature field replaces full solver
- 05 性能预测 Property prediction 延展性 · 疲劳 · 断裂 · 强度 Ductility · fatigue · fracture · strength
多尺度耦合 · 熔池 → 微观 → 介观 → 宏观Multi-scale coupling · melt pool → grain → meso → macro
探索全部仿真能力 Explore our simulation capabilities
9 大类 · 60+ 项功能 — 鼠标悬停在任一类别上展开详情。 9 categories · 60+ functions — hover any card to expand its details.
一 · 粉末铺展与输送I · Powder spreading & feeding
- 铺粉沉积机理仿真（实验 + 颗粒尺度）Spreading mechanism (DEM + experiment)
- 粉层堆积质量评估Powder-bed quality
- 高速铺粉对零件质量影响High-speed recoating effects
- 微尺度静电力对铺粉的影响Electrostatic forces in spreading
- 多相流送粉流仿真Multiphase powder feeding
- 短纤维 / 聚合物复合颗粒铺展与取向Fiber / polymer composite spreading
- 粉末飞溅、卷吸及缺陷形成Spatter, entrainment & defects
- 不同气流条件下飞溅轨迹与残留Spatter trajectories under gas flow
二 · 熔池与匙孔动力学II · Melt-pool & keyhole
- 气-熔池-粉末耦合多相流Gas–pool–powder multiphase
- 匙孔动力学与匙孔气孔机理Keyhole dynamics & porosity
- 蒸发模型与成分演化Evaporation & composition shift
- 气-液金属反应Gas–liquid metal reactions
- 氧含量对熔池动力学影响Oxygen effects on melt-pool
- 热电磁流体动力学 (TEMHD)TEMHD coupling
- 静磁场辅助致密化与晶粒细化Static magnetic-field assist
- 超声辅助调控熔池动力学Ultrasonic melt-pool control
- 熔池振荡Melt-pool oscillation
- 激光焊接传热与熔流（匙孔 / 过渡 / 传导）Laser welding regimes
- 预热阶段粉末烧结Pre-heating sintering
- 金属玻璃结晶预测Metallic-glass crystallization
- 高反射率金属粉末床激光吸收Reflective powder laser absorption
三 · 微观组织演化III · Microstructure evolution
- 元胞自动机枝晶生长（多重网格）CA dendrite growth (multigrid)
- 相场晶粒演化（形核-生长-粗化）Phase-field grain evolution
- 流场对枝晶生长与 CET 的影响Flow-affected CET
- 3D 枝晶生长与缩孔形成3D dendrites & shrinkage porosity
- 析出过程Precipitation kinetics
- 晶粒结构演化Grain-structure evolution
- 金属基复合材料增强颗粒分散MMC reinforcement dispersion
四 · 力学性能与应力IV · Mechanics & residual stress
- 热应力高保真仿真（热流-力学耦合）Coupled thermo-mechanical
- 晶体塑性Crystal plasticity
- 微尺度残余应力（单元消除 / 重激活）Micro-scale residual stress
- 位错动力学与微尺度损伤Dislocation dynamics & damage
- 应变局部化Strain localization
- 疲劳裂纹萌生（GND / SED 多尺度）Fatigue initiation (GND / SED)
- 蠕变与筏化（rafting）Creep & rafting
- 各向异性高温变形Anisotropic high-T deformation
- 多尺度结构-性能关系Multi-scale structure–property
五 · 复合材料与聚合物V · Composites & polymers
- 粘弹性 / 弹粘塑性聚合物流动Visco-elastic polymer flow
- 非等温聚合物流动Non-isothermal polymer flow
- 短纤维断裂Short-fiber breakage
- 连续碳纤维复合材料压缩 / 拉伸失效CFRP compression / tensile failure
- 复合材料微观力学失效准则Micro-mechanics failure criteria
六 · 粘结剂喷射VI · Binder jetting
- 粘结剂-粉末相互作用Binder–powder interaction
- 粘结剂流动与粉末动力学Binder flow & powder dynamics
- 粘结剂干燥、层间偏移与层间结合Drying & inter-layer bonding
七 · 数据驱动建模VII · Data-driven modeling
- 机器学习代理模型（焊缝 / 匙孔几何）ML surrogate (weld / keyhole)
- 数据驱动温度场预测Data-driven temperature field
- 高斯过程回归（熔覆道几何）GPR for clad geometry
- 数据驱动匙孔特征预测Data-driven keyhole features
- 材料参数不确定性析因设计UQ for material parameters
- 机器学习辅助传热预测ML-assisted heat transfer
八 · 设计优化与系统级VIII · Design optimization & systems
- 拓扑优化散热器Topology-optimized heatsinks
- 紧凑型板翅式热交换器Compact plate-fin heat exchanger
- 热电模块 + 3D 打印热交换器系统TE module + printed HX system
- 等几何拓扑优化（拉胀复合材料）Isogeometric topology optim. (auxetics)
九 · 集成建模框架IX · Integrated frameworks
- 工艺-结构-性能 (PSP) 集成建模框架Process–Structure–Property framework
- 多尺度多物理场建模框架Multi-scale multi-physics framework
- 电子束-基板相互作用热源模型EB–substrate heat-source model
- 功能梯度材料增材制造多尺度建模FGM multi-scale AM modeling